Global Wire Wound Surface Mount Market growing at a CAGR of 4.4% from 2023 to 2030
Category : Semiconductor And Electronics | Published Date : May 2023 | Type : Press Release
Key Market Overview
The Wire Wound Surface Mount market is poised for strong expansion and is projected to reach USD 1,667.79 Million by 2030. The market was sized at USD 1,205.27 Million in 2022 and is predicted to grow at a compound annual growth rate of 4.4% during the period 2023-2030.
The report highlights the increasing adoption of wire wound surface mount in consumer electronics including smartphones, tablets, wearables, and smart home devices to offer miniaturization due to the small form factor and surface mount packaging. Consegic Business Intelligence provides an inclusive research report on the wire wound surface mount market that evaluates multiple factors, such as market size, value, supply chain, regulatory environment, and trends.
Global Wire Wound Surface Mount Market By Overview
The report analyses significant segments such as type, application, and region, to identify emerging trends and potential opportunities. The metal composites segment is expected to grow during the forecast period owing to the high current handling capacity, low resistance, and excellent thermal characteristics. The metal components, particularly aluminum and copper effectively handle high currents while maintaining low resistance values. Furthermore, the metal composites are suitable for industrial and automotive applications that require efficient energy transfer and minimal power losses.
Get Free SampleMarket Dynamics
Driver:
- The growing demand for energy-efficient devices is driving the growth of the wire wound surface mount market to handle large amounts of current
- The ability of wire wound surface mount components to offer miniaturization in consumer electronics is accelerating the market growth.
- The increasing adoption of wire wound surface mount components in high-power motor drives, industrial automation, and renewable energy applications is boosting the market growth.
Restraints:
- Improper thermal management techniques resulting in overheating of the electronic device is restraining the market growth
- The presence of alternatives including thin film resistors to provide improved precision and accuracy is hampering the growth of the market.
Market Segmentation:
| Report Attributes | Report Details |
| By Type | Metal Composite, Ferrite, Iron, and Others |
| By Application | Maximum DC Current<0.1A, Maximum DC Current:0.1A-5A, Maximum DC Current:5A-10A, and Others |
| By Region | North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa |
Competitive Landscape :
The landscape for Wire Wound Surface Mount Market is highly competitive with major players including Bourns, Inc., TDK Electronics AG, BI Technologies, and Cooper Bussmann that have a strong market position in current market circumstances. Further, the wire wound surface mount market is expected to witness significant growth in coming years owing to the expanding semiconductor and electrical industry. The market players compete for a firm market position through mergers and acquisitions, product innovations, and business strategies. Thus, evolving research and developments in the wire wound surface mount market are expected to help market players adopt innovative ways of product creation to cater to the growing needs of various end-use industries.
- Bourns, Inc.
- TDK Electronics AG
- BI Technologies
- Cooper Bussmann
- KEMET Corporation
- Murata Manufacturing Co., Ltd.
- NIC Components
- TE Connectivity
- Vishay Intertechnology, Inc.
- Panasonic Holdings Corporation
