Global Wafer Fabrication Market to Reach USD 105.98 Billion by 2031 | CAGR of 5.3%
Category : Semiconductor And Electronics | Published Date : Oct 2024 | Type : Press Release
Wafer Fabrication Market Scope & Overview:
According to the new report published by Consegic Business Intelligence the Global Wafer Fabrication Market size was valued at USD 67.81 Billion in 2022 and is expected to grow at a CAGR of 5.3% during the forecast period, reaching USD 105.98 Billion by 2031. Wafer fabrication, also known as semiconductor fabrication, is the process of creating integrated circuits on semiconductor wafers. These wafers are essential components of various microelectronic devices.
The report comprises the Wafer Fabrication Market Share, Size & Industry Analysis, By Size (Below 50 mm, 50 mm-100 mm, 101 mm-200 mm, and Above 200 mm), By Fabrication Process (Front End Processing and Back End Processing), By Application (Automotive, Consumer Electronics, Aerospace & Defense, Healthcare, Telecommunication, and Others), By Region (North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa), and Forecast, 2023-2031.
The report contains detailed information on Wafer Fabrication Market Trends, Opportunities, Value, Growth Rate, Segmentation, Geographical Coverage, Company Profile, In-depth Expert Analysis, Revenue Forecast, Competitive Landscape, Growth Factors, Restraints or Challenges, Environment & Regulatory Landscape, PESTLE Analysis, PORTER Analysis, Key Technology Landscape, Value Chain Analysis, and Cost Analysis.
The increasing integration of semiconductor wafers in the automotive industry, particularly for advanced driver assistance systems and electric vehicles, is driving wafer fabrication market growth. Additionally, the expanding consumer electronics sector, fueled by rising demand for smartphones, laptops, and tablets, is contributing significantly to the demand for wafer fabrication.
Segmental Analysis :
Based on size, the market is segmented into below 50 mm, 50 mm-100 mm, 101 mm-200 mm, and above 200 mm.
- The 101 mm-200 mm segment held the largest market share in 2022, driven by its use in integrated circuits (ICs), optoelectronic devices, and microelectromechanical systems (MEMS).
- The above 200 mm segment is anticipated to witness the fastest growth, fueled by its applications in automotive, telecommunications, and other industrial sectors.
Based on the fabrication process, the market is divided into front-end processing and back-end processing.
- Front-end processing accounted for the largest market share in 2022, primarily due to its use in forming circuits on the surface of the wafer.
- Back-end processing is expected to grow at the fastest rate, as it involves cutting wafers into individual dice and embedding them in packages for connection to circuit boards.
Based on the application, the market includes automotive, consumer electronics, aerospace & defense, healthcare, telecommunications, and others.
- Consumer electronics held the largest share in 2022, driven by the rising demand for semiconductors in smartphones, laptops, and other devices.
- The automotive sector is expected to grow at the fastest pace, supported by the increasing production of electric vehicles and advancements in autonomous driving technologies.
Based on regions, the global market is segmented into North America, Europe, Asia Pacific, the Middle East and Africa, and Latin America.
- North America accounted for the largest market share in 2022, driven by the presence of key wafer fabrication providers and a robust automotive and electronics sector.
- Asia-Pacific is projected to grow at the highest CAGR, owing to the rapid industrialization and growth in the consumer electronics and automotive sectors, particularly in China and India.
| Report Attributes | Report Details |
| Study Timeline | 2017-2031 |
| Market Size in 2031 | USD 105.98 Billion |
| CAGR (2024-2031) | 5.3% |
| By Size | Below 50 mm, 50 mm-100 mm, 101 mm-200 mm, Above 200 mm |
| By Fabrication Process | Front End Processing, Back End Processing |
| By Application | Automotive, Consumer Electronics, Aerospace & Defense, Healthcare, Telecommunication, Others |
| By Region | North America(U.S., Canada, Mexico) Europe(U.K., Germany, France, Spain, Italy, Russia, Benelux, Rest of Europe) APAC(China, South Korea, Japan, India, Australia, ASEAN, Rest of Asia-Pacific) Middle East & Africa(GCC, Turkey, South Africa, Rest of MEA) LATAM(Brazil, Argentina, Chile, Rest of LATAM) |
Top Key Players & Competitive Landscape :
The competitive landscape encompasses major innovators, aftermarket service providers, industry giants, and niche players, all of which are thoroughly examined by Consegic Business Intelligence in terms of their strengths, weaknesses, and value-addition potential. This report includes detailed profiles of key players, market share analysis, mergers and acquisitions, resulting market fragmentation, and emerging partnership trends and dynamics.
List of prominent players in the Wafer Fabrication Industry:
- Taiwan Semiconductor Manufacturing Company Limited
- Tokyo Electron Limited
- Intel Corporation
- Lam Research Corporation
- Motorola Solutions Inc.
- Applied Materials Inc.
- KLA Corporation
- STMicroelectronics
- SOITEC
- Samsung
Recent Industry Developments :
- In July 2023, Applied Materials Inc. introduced its new wafer manufacturing platform, Vistara, designed to provide chipmakers with the intelligence, flexibility, and sustainability required to tackle growing chip-making challenges.
