Global Electronic Packaging Market to Reach USD 6,994.37 Million by 2031 | CAGR of 18.78%
Category : Semiconductor And Electronics | Published Date : Dec 2024 | Type : Press Release
Electronic Packaging Market Scope & Overview:
As per the Consegic Business Intelligence newly published report, the Electronic Packaging Market size was valued at USD 1,765.48 million in 2023 and is projected to grow at a CAGR of 18.78%, reaching USD 6,994.37 million by 2031. Electronic packaging refers to the design and manufacture of enclosures, casings, and substrates to safeguard electronic components from environmental factors like moisture, dust, and mechanical stress. It also facilitates thermal management and electrical interconnections, playing a vital role in ensuring the reliability and performance of electronic devices.
The report comprises the Electronic Packaging Market Share, Size & Industry Analysis, based on Material Type (Plastic, Glass, Metal, Ceramics), Packaging Type (Surface Mount Packaging, Through-Hole Packaging, Hybrid Packaging), End-User Industry (Consumer Electronics, Automotive, Aerospace & Defense, Healthcare, IT & Telecom, Others), and Region (North America, Europe, Asia-Pacific, Latin America, Middle East & Africa), and Forecast, 2024-2031.
The report contains detailed information on Electronic Packaging Market Trends, Opportunities, Value, Growth Rate, Segmentation, Geographical Coverage, Company Profiles, In-depth Expert Analysis, Revenue Forecast, Competitive Landscape, Growth Factors, Restraints or Challenges, Environment & Regulatory Landscape, PESTLE Analysis, PORTER Analysis, Key Technology Landscape, Value Chain Analysis, and Cost Analysis.
The market is driven by growing demand for compact and efficient consumer electronics and the rise of advanced technologies in automotive and healthcare sectors. However, challenges in thermal management for high-density applications could hinder growth.
Segmental Analysis :
Based on material type, the market is segmented into Plastic, Glass, Metal, and Ceramics.
- The Plastic segment accounted for the largest share of 46.20% in 2023, driven by its lightweight, cost-effectiveness, and excellent insulating properties. Advancements in biodegradable and recyclable plastics are further propelling growth.
- The Ceramics segment is expected to grow at the fastest CAGR, supported by its superior thermal conductivity and high-temperature resistance, making it ideal for aerospace and defense applications.
Based on packaging type, the market is segmented into Surface Mount Packaging, Through-Hole Packaging, and Hybrid Packaging.
- The Surface Mount Packaging segment dominated the market in 2023, owing to its extensive use in compact and lightweight electronic devices. Its ease of assembly and suitability for high-speed manufacturing processes contribute to its dominance.
- The Hybrid Packaging segment is projected to grow at the fastest CAGR, driven by its flexibility in design and functionality, especially in aerospace and healthcare applications.
Based on end-user industry, the market is segmented into Consumer Electronics, Automotive, Aerospace & Defense, Healthcare, IT & Telecom, and Others.
- The Consumer Electronics segment led the market in 2023, fueled by the growing adoption of IoT-enabled devices and smart home technologies.
- The Aerospace & Defense segment is expected to grow rapidly, driven by the need for durable and reliable packaging solutions for mission-critical systems like avionics and satellite communication.
Based on regions, the market is segmented into North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa.
- Asia-Pacific: Held the largest share in 2023, valued at USD 519.29 million, driven by industrialization and the region's role as a global hub for electronics manufacturing.
- North America: Expected to grow significantly, with an estimated market size of USD 2,301.15 million by 2031, supported by early adoption of innovative technologies and strong demand from the automotive and healthcare sectors.
| Report Attributes | Report Details |
| Study Timeline | 2018-2031 |
| Market Size in 2031 | USD 6,994.37 Million |
| CAGR (2024-2031) | 18.78% |
| Material Type | Plastic, Glass, Metal, Ceramics |
| Packaging Type | Surface Mount Packaging, Through-Hole Packaging, Hybrid Packaging |
| End-User Industry | Consumer Electronics, Automotive, Aerospace & Defense, Healthcare, IT & Telecom, Others |
| By Region | North America(U.S., Canada, Mexico) Europe(U.K., Germany, France, Spain, Italy, Russia, Benelux, Rest of Europe) APAC(China, South Korea, Japan, India, Australia, ASEAN, Rest of Asia-Pacific) Middle East & Africa(GCC, Turkey, South Africa, Rest of MEA) LATAM(Brazil, Argentina, Chile, Rest of LATAM) |
Top Key Players & Competitive Landscape :
The competitive landscape encompasses major innovators, aftermarket service providers, industry giants, and niche players, all of which are thoroughly examined by Consegic Business Intelligence in terms of their strengths, weaknesses, and value-addition potential. This report includes detailed profiles of key players, market share analysis, mergers and acquisitions, resulting market fragmentation, and emerging partnership trends and dynamics.
List of prominent players in the IoT Microcontroller Industry:
- Amkor Technology, Inc. (USA)
- ASE Technology Holding Co., Ltd. (Taiwan)
- JCET Group Co., Ltd. (China)
- Intel Corporation (USA)
- Samsung Electronics Co., Ltd. (South Korea)
- Advanced Semiconductor Engineering, Inc. (Taiwan)
- Nippon Mektron, Ltd. (Japan)
- STATS ChipPAC Ltd. (Singapore)
- SPIL (Siliconware Precision Industries Co., Ltd.) (Taiwan)
- Powertech Technology Inc. (Taiwan)
Recent Industry Developments :
- August 2024: AOS (Alpha and Omega Semiconductor) expanded its surface mount package offerings with the LFPAK 5x6 package, catering to high-reliability applications in industries like industrial, server, and telecom.
